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DOT CONNECTOR  (NEW)

MICROPHONE HOLDER 
MULTI-COLOR RUBBER
MT (Matrix Type)
CONDUCTIVE RUBBER
SOFT METAL CONDUCTIVE PILL
FMC (FLEXIBLE METAL CIRCUIT)
KEY PAD
THERMAL PAD
EASY PASTE
　  
   
   
　
　
Exhibitions
 

NEPCON JAPAN2011/R&D JAPAN

Venue: Tokyo Big Sight, Japan
Date:  2011/01/19~21
Booth No:

Semicon China 2011

Venue: Shanghai, China
Date:  2011/03/15~17
Booth No: 2354

Semicon Taiwan

Location: Taipei, Taiwan
Date:  2011/09/07~09
Booth No: 1161

Semicon JAPAN 2010

Venue: Chiba, Japan
Date:  2010/12/01~03
Booth No:

Electronica 2010

Venue: Munchen, Germany
Date:  2010/11/09~12
Booth No: B3 161/6

Electronica Asia 2010

Location: Hong Kong
Date:  2010/10/13~16
Booth No: 5FC35
　
　
　
　
　
　 　

　 　

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